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OHB Automatic Dust Removal System for Semiconductor Manufacturing

Overview

The Villo Non-Contact Dust Removal Module is designed for precision dust removal applications in semiconductor manufacturing and other industries requiring surface cleanliness.

By generating high-speed pulsed airflow through specially designed flow channels, the system detaches fine particles from surfaces without physical contact. The particles are then collected through negative-pressure airflow, helping prevent particle escape and maintain a clean production environment.

The module can be customized to suit different surface shapes, materials, and application requirements. It can be integrated with a dust collection unit or existing production lines, helping reduce installation complexity and production downtime.

Features

  • Non-Contact Dust Removal
      • High-Efficiency Fine Particle Removal
      • Balanced Positive- and Negative-Pressure Airflow
    • Flexible and Compact Design
    • Easy Integration into Existing Production Lines

    Applications & Industries

    Technical Parameters

    Item Specification
    Model VS-AOC-01
    Dimensions (W × D × H) 388 × 353 × 337 mm
    Dust Removal Performance (Remaining Particle Count After Cleaning) ≤ 20 particles/cm² (0.3 μm)
    Cleaning Area OHB Surface
    Weight (kg) ≤ 11
    Maximum Power (W) 700
    Cleaning Capacity per Full Charge 15–20 cleaning cycles
    Noise Level (dB) ≤ 80
    Filtration Grade U15
    Material Aluminum Alloy, PEEK, etc.

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