Dust Control for Semiconductor

Wafer Grinding Dust Treatment

The large-volume dust collector developed in accordance with environmental emission requirements is mainly used in wafer polishing equipment in the semiconductor industry to handle large amounts of flammable and explosive silicon powder generated during the wafer grinding process.

Solutions

The VW-150wafer Fab equipment mainly combines cyclone dust removal with spray dust removal, so that the silicon powder is fully captured by the water mist sprayed from the high-pressure nozzle to form a dust-water mixture, which is deposited in the collection bucket due to gravity and discharged outward through the overflow port to complete the dust removal.