Dust Control for Semiconductor

Ultrasonic Dust Removal On Wafer Surface

In the later stages of wafer grinding and polishing, residues may affect the performance and reliability of the device. To ensure the cleanliness and quality of the wafer, rapid cleaning technology is required to remove dust and foreign matter on the surface of the wafer to ensure that product quality requirements are met.

Solutions

Using non-contact ultrasonic dust removal technology, the equipment includes an ultrasonic dust removal head with adjustable width and a blower-suction integrated dust removal machine. The high-speed airflow generated by the ultrasonic dust removal head can effectively remove dust particles with larger particle sizes, and at the same time, the high-frequency and high-intensity ultrasonic waves can effectively destroy the air boundary layer formed by the airflow on the surface of the material, so that dust particles with smaller particle sizes are blown up by the high-speed airflow and then adsorbed into the negative pressure chamber.